We are your competent business partner for the cost-efficient production of circuit boards. According to your requirements we will take your order from development and sourcing up to the actual assembling.

Methods

 

Through Hole Technology (THT)

This technology uses lead wired components which were put through previously drilled holes on the circuit board and soldered to pads on the opposite side. 

 

Surface Mounted Technology (SMT)

In the SMD Technology the electronic components are mounted directly on the surface of the circuit board by the use of stannic coated soldering pads. Because just one side of the board is used it is possible to cover both side with SMD components to optimize the usage of free space.

 

Combined Assembling

Combining the two technologies from above make it possible to take advantage of not only lead wired, mechanically and thermically resilient components or the small complex SMD components but of both.

Pictures

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